Job Description

With the continuously expanding heterogeneous integration landscape to enable 2.5D/3D connectivity solutions, the Embedded Silicon Bridge Process Development team is excited to announce we are seeking a new Process Integration Yield/Device Development Engineer.

As a Process Integration Yield/Device Development Engineer you will be responsible for but not limited to:

• Design and execution of experiments for next-generation Embedded Multi-die Interconnect Bridge (EMIB) products.

• Defining and establishing process recipes, flows, characterization windows, and specifications for new products.

• Partnering with Technology Development (TD) process engineering module teams to select required equipment to develop new devices or products.

• Collaborating with upstream and downstream customers to meet product requests, develop design rules, and manage interactions while ensuring manufacturability and reliability goals can be met.

• Planning and conducting experiments and data analysis to optimize and characterize new processes and understand sources of variation within the fab to improve process stability/capability.

• Developing solutions to problems utilizing formal education, statistical knowledge, experiment design, industry literature, and problem-solving tools.

• Developing strategies to resolve difficult problems and establishing systems to deal with these problems in the future.

The ideal candidate should exhibit the following behavioral traits:

• Excellent communication skills and demonstrated willingness to work across organizational boundaries to meet objectives and key results while fostering a challenging and positive work environment.

• Demonstrated track record of leading process integration and module engineering co-development.

• High tolerance of ambiguity demonstrated flexibility and adaptability in a fast-changing environment.

• Established track record of problem-solving with creativity and out-of-box thinking as well as future, strategic, and possibility thinking.

This position requires to be onsite in Rio Rancho, NM. You must work a minimum of six months onsite before working hybrid.

Relocation assistance provided.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• The candidate must possess a Bachelor's degree in Engineering, Computer Science, or Device Physics (a higher technical degree strongly preferred) and have demonstrated increasing levels of technical leadership responsibilities in technology development as well as 5+ years of semiconductor process development and manufacturing experience.

• 3+ years of strong technical depth and demonstrated fab interconnect / middle of line / back end of line (BEOL) integration development expertise.

• 5+ years leading technical teams and task forces, driving them to successful completion and mentoring others in resolving technical issues.

Preferred Qualifications:

• Master's or Ph.D. degree in Engineering, Computer Science, or Device Physics.

• Embedded Silicon Bridge process integration experience.

• Demonstrated track record of process development and transfer/startup.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.