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Intel Test Chip Engineer in Malaysia

Job Description

This position is within the Design Enablement (DE) organization of Intel Technology Development group. We are looking for a talented individual to join Test Chip Engineering team to execute Test Chip design from early pathfinding to maturity on advanced Si technology nodes and enable diverse DE teams to contribute targeted test structures through design automation and collateral support.

The team involves in the following activities

  • Physical design using automation

  • Currently using p-cell in SKILL (planning to move some code to python OA)

  • QA of p-cell templates

  • Test structure generation using the p-cell templates

  • Layout analytics, ICV, Calibre like code

  • GUI development (eg. like gpds)

  • Routing code, fill code

  • Extraction

  • LVS

  • DA support in environment

  • Tapein

#DesignEnablement

Qualifications

You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

  • Bachelor Degree (Masters Degree preferred) in Electrical Engineering, Computer Engineering, or other related field of study.

  • 6+ years of relevant experience in layout design and/or Tool Flow Methodology (TFM) development

Experience in the following areas:

  • Use of industry Layout editing and verification CAD tools

  • Strong in programming

  • Successfully led one or more design tape-outs using advanced foundry nodes.

  • Able to provide technical guidance and support to team members throughout the project cycle.

  • Excellent verbal communication, technical presentation and leadership skills.

  • Self-motivated and well organized.

#designenablement

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

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